Features, Specifications, Alternative Product, Product Training Modules, and Datasheets are all available.
By using a jumper, the master clock, local power supplies, and power-up sequence components can be bypassed. Browse DigiKeys inventory of IM69D12xMicrophones. The FLIR Lepton® Thermal Camera Breakout Board is an easy-to-interface evaluation board to quickly connect all versions of the FLIR Lepton camera module to common platforms like Raspberry Pi or custom hardware such as mobile development kits. This easy-to-interface evaluation board provides onboard power supplies, generated from 3V to 5.5V, and a master clock. 250-0577-00 - FLIR Lepton® Camera Breakout Board v2.0. 10.5mm x 12.7mm x 7.14mm package dimensionsįLIR Lepton Camera Breakout Board v2.0 quickly connects all versions of the FLIR Lepton camera module to common platforms like Raspberry Pi or custom hardware.Longwave infrared, 8µm to 14µm spectral range.Uses standard cell phone-compatible power supplies.Increased scene dynamic range of +400☌ (Lepton 3.5 module only).Integrated digital thermal image processing.FLIR Lepton 3.0 and 3.5 Micro Thermal Camera Modules feature low power consumption, unmatched image quality, and simple integration. While the 3.5 offers the same size, it also provides calibrated radiometric output across the entire 19,200 pixel array. Both modules feature a CCI (I 2C-like) control port and video over SPI video data interface. The 3.0 module is non-radiometric, while the 3.5 module has a radiometric thermal imaging system. FLIR Lepton 3.0 and 3.5 Micro Thermal Camera Modules offer 160 x 120 active pixels and <50mK thermal sensitivity in a small 11.8mm x 12.7mm x 7.2mm package.
0 kommentar(er)
